Dr. Gary H. Bernstein



Gary H. Bernstein is the Frank M. Freimann Professor of Electrical Engineering at the University of Notre Dame. He has authored or co-authored 17 patents and more than 300 publications in the areas of infrared sensors, electron beam lithography, nanomagnetics, quantum electronics, high-speed integrated circuits, electromigration, MEMS, and electronics packaging. Bernstein was named a Fellow of the IEEE in 2006, and with his student received the Sensors and Transducers Journal Best Paper of the Year Award for 2006 and, as lead author, the IEEE Transactions on Advanced Packaging Best Paper of the Year Award in 2007. He received the Innovation Excellence Award from the Indiana Economic Development Center and Forbes Summit Group, Indianapolis, November, 2014, and the 1st Source Commercialization Award for Quilt Packaging development, April, 2016. Bernstein was inducted into the National Academy of Inventors in 2020. Bernstein is cofounder of Indiana Integrated Circuits, LLC (www.indianaic.com) based in South Bend, IN.

IMPORTANT DATES
May
20
2022

Final Extended Paper Submission Deadlines

May
27
2022

Final Extended Notification to Authors

Jun
3
2022

Final Extended Early-Bird Registration