Gary H. Bernstein is the Frank M. Freimann Professor of Electrical Engineering at the University of Notre Dame. He has authored or co-authored 17 patents and more than 300 publications in the areas of infrared sensors, electron beam lithography, nanomagnetics, quantum electronics, high-speed integrated circuits, electromigration, MEMS, and electronics packaging. Bernstein was named a Fellow of the IEEE in 2006, and with his student received the Sensors and Transducers Journal Best Paper of the Year Award for 2006 and, as lead author, the IEEE Transactions on Advanced Packaging Best Paper of the Year Award in 2007. He received the Innovation Excellence Award from the Indiana Economic Development Center and Forbes Summit Group, Indianapolis, November, 2014, and the 1st Source Commercialization Award for Quilt Packaging development, April, 2016. Bernstein was inducted into the National Academy of Inventors in 2020. Bernstein is cofounder of Indiana Integrated Circuits, LLC (www.indianaic.com) based in South Bend, IN.

Giacomo OLIVERI received the B.S. and M.S. degrees in Telecommunications Engineering and the PhD degree in Space Sciences and Engineering from the University of Genoa, Italy, in 2003, 2005, and 2009 respectively. He is currently an Associate Professor at the Department of Civil, Environmental and Mechanical Engineering (University of Trento) and a Board Member of the ELEDIA Research Center. Moreover, he is Adjunct Professor at CentraleSupélec and member of the Laboratoire des signaux et systèmes (L2S)@CentraleSupélec Gif-sur-Yvette (France). He has been a visiting researcher at L2S in 2012, 2013, and 2015, Invited Associate Professor at the University of Paris Sud, France, in 2014, and visiting professor at Université Paris-Saclay in 2016 and 2017.